Guide Air Labs

Design and Development of DAQ Package for Aerospace Applications

The project aims to develop a consumer-ready aerospace product. Students will work to: 1. Design, fabricate, and assemble small PCBs. 2. Design and manufacture a waterproof enclosure for the PCBs. 3. Develop a MicroPython/C++/Arduino API for flight computer communication. PCB Dimensions: The dimensions of the PCBs will be constrained to 7 by 6 centimeters or smaller. Multiple PCB boards will be stacked as needed, with height restrictions determined by the sensors and components selected by the student team. Enclosure Specifications: The enclosure will be designed to meet IP67 standards, ensuring it is dust-tight and can withstand immersion in water up to a depth of 1 meter for 30 minutes. The design must include waterproof connectors and allow for ease of assembly and disassembly to facilitate testing and maintenance. System Performance: All electronic systems must operate at a minimum frequency of 100Hz to ensure real-time data processing and communication, which is critical for aerospace applications. As the project outcome, this student team will work to deliver a fully operational, consumer-grade product for aerospace applications. This product will include a custom-designed PCB housed within a durable, waterproof enclosure, and will feature an API for seamless integration with a flight computer. Students will acquire practical experience in PCB design, enclosure fabrication, and software development, equipping them with a broad skill set applicable to aerospace engineering and related fields.