The University of Washington Microfabrication Facility is open to academic and industry product developers.
Wafer Materials & Sizes
Our cleanroom processes primarily silicon substrates, although we also have experience with silicon on sapphire, quartz, compound semiconductors and other less common materials. The wafer size for which we have the most equipment is 4", but we also process wafers from 3" to 8". Wafer thickness vary from 200 micron to 1 mm substrates. Some clients utilize other materials such as piezoelectrics, polymers, and photonic materials.
Lab cleanroom is Class 10,000.
The UW MFF provides a wide range of microprocessing capabilities, including:
- Patterning, by contact photolithography and electron beam lithography
- Etching, using either a wide range of wet chemical etchants, or many dry etching systems, including Fluorine RIE, both Fluorine and Chlorine ICP, and Bosch deep silicon etching.
- Physical Vapor Deposition, including electron beam evaporation and sputter deposition
- Chemical Vapor Deposition, including PECVD of silicon oxides and nitrides, LPCVD nitrides and oxides
- Annealing and curing, including both tube furnaces and rapid thermal annealing
- Inspection including optical and electron microscopes
- Thin Film Metrology including film thickness, step height, and resistivity
MFF Documents and Resources
Microfabrication Facility Rates
Lab User Manual
Lab User Manual - Addendum
Lab User Manual Quiz
Health and Safety Plan
Facility Use Agreement - UW
Facility Use Agreement - Non-UW
Fluke Hall EEOP (Emergency Evacuation and Operations Plan)
New user application form
Remote CORAL Access
CORAL Web Front-End